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MF-ATL系列贴膜机
    发布时间: 2022-04-13 16:30    

Features

Easy operation and maintenance by soft were are calibration.
6~ 8 inch and 8~12 inch wafer capability.
Tape capable of normal and UV tape.
High accuracy lamination by pre-aligner .
Air bubble free lamination.
Adjustable cutting blade angle.
Precision edge cutting for optimum wafer back-grinding.
No tape burr and tail after lamination.
Minimum tape consumption.
Easy tape setting by one touch locker.
High precise robotic handler.

Quick and easy conversion for different size wafer.

Capable of Bumping wafer by special bond roller.










服务热线:021-64307580

传真:021-64306520
邮箱:shanghai@mfinetech.com
地址:上海市金山区春丽路1239号国际中小企业产业园   (二期) 6号楼
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