Features

◆ Easy operation and maintenance by soft were are calibration.
◆6~ 8 inch and 8~12 inch wafer capability.
◆Tape capable of normal and UV tape.
◆High accuracy lamination by pre-aligner .
◆Air bubble free lamination.
◆Adjustable cutting blade angle.
◆Precision edge cutting for optimum wafer back-grinding.
◆No tape burr and tail after lamination.
◆Minimum tape consumption.
◆Easy tape setting by one touch locker.
◆High precise robotic handler.

◆ Quick and easy conversion for different size wafer.

◆Capable of Bumping wafer by special bond roller.