设备特点：

♦ Easy operation and maintenance by soft were are calibration.

软件标准，操作方便，维护方便

♦ 6~8 inch and 8~12 inch wafer capability.

6- 8英寸和8~12英寸晶圆能力

♦ Tape capable of normal and UV tape.

可满足普通胶带和UV胶带

♦ High accuracy lamination by pre-aligner.

高精度贴合

♦ Air bubble free lamination.

无气泡分层

♦ Adjustable cutting blade angle.

切割刀片角度可调

♦ Precision edge cutting for optimum wafer backgrounding.

精确的边缘切割，满足最佳的圆片研磨

♦ No tape burrand tail after lamination.

覆膜后无带毛刺和带尾

♦ Minimum tape consumption.

最小的胶带损耗

♦ Easy tape setting by onetouch locker.

一键锁止装置轻松设置胶带

♦ High precise robotic handler.

高精度自动机械臂

♦ Quick and easy conversion for different size wafer.

快速和简单的转换，不同尺寸的晶圆

♦ Capable of Bumping wafer by special bond roller.

可通过特殊的粘接滚筒进行压片